Ground Breaking For New Infineon Smart Power Fab Chip Factory

DRESDEN, GERMANY - MAY 02: (L-R) Saxony Premier Michael Kretschmer, European Commission President Ursula von der Leyen and German Chancellor Olaf Scholz hold semiconductor wafers as Infineon Technologies CEO Jochen Hanebeck (2nd from R) looks on after they symbolically broke ground for the new Infineon Smart Power Fab semiconductor factory on May 02, 2023 in Dresden, Germany. The new factory, which is being built adjacent to an existing factory that produces 200mm and 300mm wafers, will produce 300mm wafers and create 1,000 new jobs. Europe is seeking to expand its domestic semiconductor production in order to become less reliant on producers in Asia. (Photo by Sean Gallup/Getty Images)
DRESDEN, GERMANY - MAY 02: (L-R) Saxony Premier Michael Kretschmer, European Commission President Ursula von der Leyen and German Chancellor Olaf Scholz hold semiconductor wafers as Infineon Technologies CEO Jochen Hanebeck (2nd from R) looks on after they symbolically broke ground for the new Infineon Smart Power Fab semiconductor factory on May 02, 2023 in Dresden, Germany. The new factory, which is being built adjacent to an existing factory that produces 200mm and 300mm wafers, will produce 300mm wafers and create 1,000 new jobs. Europe is seeking to expand its domestic semiconductor production in order to become less reliant on producers in Asia. (Photo by Sean Gallup/Getty Images)
Ground Breaking For New Infineon Smart Power Fab Chip Factory
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Credit:
Sean Gallup / Staff
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1487067466
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Getty Images News
Date created:
02 May, 2023
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